How can semiconductor manufacturers detect defects that conventional tests miss? This question took centre stage as Prof. Said Hamdioui and his team presented a tutorial on Device-Aware Test (DAT) at the IEEE International Test Conference (ITC) in San Antonio, USA.
Bringing together participants from academia and industry, the tutorial demonstrated how linking physical defect behaviour to test generation can strengthen defect detection in emerging memories. It highlighted DAT’s potential to improve chip quality and reliability, accelerate diagnosis and yield learning, and optimise testing costs.
The event sparked fruitful discussions with representatives from Renesas, Cisco, Cadence, Hitachi, Siemens, Intel, TSMC, and Advantest, among others. These exchanges provided a valuable opportunity to discuss industrial testing challenges and explore where DAT could deliver the greatest impact.
Supported by the European Innovation Council’s EIC Transition programme, POPCORN is advancing DAT from research towards commercial deployment. Engagement with the international test community supports this journey, helping connect technology development with industry needs as the team prepares a future spin-off.
From physical defects to industrial impact: POPCORN is shaping the future of semiconductor testing.