The POPCORN project was represented at the European Test Symposium (ETS 2026), a leading European forum bringing together researchers, industry experts, and technology innovators to discuss the latest advances and challenges in electronic testing, reliability, and semiconductor technologies.
As part of the symposium, Prof. Said Hamdioui delivered a presentation entitled “Device-Aware-Test: A Means to Attack Unmodelled Defects” within Special Session 2: “Gremlins in the Silicon: Why Faulty Chips are Escaping the Fab and Crashing in the Field.”
The special session addressed one of the key challenges facing the semiconductor industry: the detection of defects that escape conventional manufacturing tests and may lead to failures during the operational lifetime of electronic devices.
In his presentation, Prof. Hamdioui highlighted the potential of Device-Aware Testing (DAT) to address unmodelled defects by incorporating a deeper understanding of device-level behaviour and defect mechanisms into testing methodologies. Such approaches can contribute to improving defect detection, reducing test escapes, and enhancing the reliability and quality of semiconductor technologies.
POPCORN’s presence at ETS 2026 reflects the project’s commitment to advancing innovative approaches to semiconductor testing and reliability, while fostering knowledge exchange and collaboration with the wider European research and industrial community.
Through its participation in international scientific events such as ETS, POPCORN continues to contribute to discussions on the challenges and future directions of semiconductor technologies.
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